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4.5.2 Single-Chip Cryptographic Modules

NIST platform security: roots of trust, firmware and secure enclaves FIPS 140-2
All changes in this version
first version loaded 4 SECURITY REQUIREMENTS part of 4.5

Title

Single-Chip Cryptographic Modules

Control

In addition to the general security requirements specified in Section 4.5.1, the following requirements are specific to single-chip cryptographic modules.

SECURITY LEVEL 1

There are no additional Security Level 1 requirements for single-chip cryptographic modules.

SECURITY LEVEL 2

In addition to the requirements for Security Level 1, the following requirements shall apply to single-chip cryptographic modules for Security Level 2.
• The cryptographic module shall be covered with a tamper-evident coating (e.g., a tamper-evident passivation material or a tamper-evident material covering the passivation) or contained in a tamper-evident enclosure to deter direct observation, probing, or manipulation of the module and to provide evidence of attempts to tamper with or remove the module.
• The tamper-evident coating or tamper-evident enclosure shall be opaque within the visible spectrum.

SECURITY LEVEL 3

In addition to the requirements for Security Levels 1 and 2, the following requirements shall apply to single-chip cryptographic modules for Security Level 3.

Either

• the cryptographic module shall be covered with a hard opaque tamper-evident coating (e.g., a hard opaque epoxy covering the passivation)

or

• the enclosure shall be implemented so that attempts at removal or penetration of the enclosure shall have a high probability of causing serious damage to the cryptographic module (i.e., the module will not function).

In addition to the requirements for Security Levels 1, 2, and 3, the following requirements shall apply to single-chip cryptographic modules for Security Level 4.

• The cryptographic module shall be covered with a hard, opaque removal-resistant coating with hardness and adhesion characteristics such that attempting to peel or pry the coating from the module will have a high probability of resulting in serious damage to the module (i.e., the module will not function).

• The removal-resistant coating shall have solvency characteristics such that dissolving the coating will have a high probability of dissolving or seriously damaging the module (i.e., the module will not function).