BaselineWatch
Desk
Your fleet and your work Fleetyour releases and the hardware they run onTriagewhat needs a decisionWatchlistthe products and platforms you runSaved searchesthe lists you come back to
This instance Sourceswhat is read, how often, under what termsDigestthe daily or weekly summary, and alerts
How it is drawn Appearancethe look and the colour schemeBrandingthe mark this instance wears
Owner sign-in

4.5.4 Multiple-Chip Standalone Cryptographic Modules

NIST platform security: roots of trust, firmware and secure enclaves FIPS 140-2
All changes in this version
first version loaded 4 SECURITY REQUIREMENTS part of 4.5

Title

Multiple-Chip Standalone Cryptographic Modules

Control

In addition to the general security requirements specified in Section 4.5.1, the following requirements are specific to multiple-chip standalone cryptographic modules.

SECURITY LEVEL 1

The following requirement shall apply to multiple-chip standalone cryptographic modules for Security Level 1.

• The cryptographic module shall be entirely contained within a metal or hard plastic production- grade enclosure that may include doors or removable covers.

SECURITY LEVEL 2

In addition to the requirements for Security Level 1, the following requirements shall apply to multiple- chip standalone cryptographic modules for Security Level 2.

• The enclosure of the cryptographic module shall be opaque within the visible spectrum.

• If the enclosure of the cryptographic module includes any doors or removable covers, then the doors or covers shall be locked with pick-resistant mechanical locks employing physical or logical keys or shall be protected with tamper-evident seals (e.g., evidence tape or holographic seals).

SECURITY LEVEL 3

In addition to the requirements for Security Levels 1 and 2, the following requirements shall apply to multiple-chip standalone cryptographic modules for Security Level 3.

Either

• the multiple-chip embodiment of the circuitry within the cryptographic module shall be covered with a hard potting material (e.g., a hard epoxy material) that is opaque within the visible spectrum

or
• the cryptographic module shall be contained within a strong enclosure such that attempts at removal or penetration of the enclosure will have a high probability of causing serious damage to the module (i.e., the module will not function).

In addition to the requirements for Security Levels 1, 2, and 3, the following requirements shall apply to multiple-chip standalone cryptographic modules for Security Level 4.

• The potting material or enclosure of the cryptographic module shall be encapsulated by a tamper detection envelope, by the use of tamper detection mechanisms such as cover switches (e.g., microswitches, magnetic Hall effect switches, permanent magnetic actuators, etc.), motion detectors (e.g., ultrasonic, infrared, or microwave), or other tamper detection mechanisms as described above for multiple-chip embedded cryptographic modules. The tamper detection mechanisms shall detect tampering by means such as cutting, drilling, milling, grinding, or dissolving of the potting material or enclosure, to an extent sufficient for accessing plaintext secret and private cryptographic keys and CSPs.
• The cryptographic module shall contain tamper response and zeroization circuitry that shall continuously monitor the tamper detection envelope and, upon the detection of tampering, shall immediately zeroize all plaintext secret and private cryptographic keys and CSPs. The tamper response and zeroization circuitry shall remain operational when plaintext cryptographic keys and CSPs are contained within the cryptographic module.